Procurement of 0617-194023HY2685/08 Huatian Science and Technology (Nanjing) Co., Ltd. "Integrated Circuits Advanced Packaging and Testing Industry Base" project in the first phase of the third tender(2)

        2020-03-06
        Project Name:Huatian Science and Technology (Nanjing) Co., Ltd. "Integrated Circuits Advanced Packaging and Testing Industry Base" project in the first phase of the third tender
        Bidding NO :0617-194023HY2685/08
        Bidding Content:SAT, 3 sets.
        Bidding Agency:Northwest(Shaanxi) International Tendering Co.,Ltd
        Purchasers:Huatian Technology (Nanjing)Co,Ltd
        Open-Time of Bids:2020-01-21 09:30
        Data of Evaluation Result:2020-03-02 14:21 - 2020-03-05 23:59
        Data of Bidding Result:2020-03-06 10:06
        Final-Winner:Teltec Semiconductor Pacific Limited
        Manufacturer:SONIX Inc.
        Manufacturer Country:USA
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